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    Dissipator® 745

    Dissipator® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator® 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components.
    SKU: 745PT
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    Products specifications
    Substrates Glass
    Substrates Metal
    Substrates Composite
    Applications Thermally Conductive
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