Hernon Manufacturing epoxies, silicones, and polyurethanes are used for potting and encapsulation. The high chemical, impact, and temperature resistance of epoxies make them ideal for protecting sensitive electronics. Hernon Manufacturing potting materials start out as low-viscosity self-leveling liquids that quickly fill gaps in and around components. Cured results can vary widely including rigid, opaque compounds or clear, flexible compounds as needed to meet manufacturing specs.
All Hernon Manufacturing potting materials are 100% solid systems with NO solvents. Curing for different formulas can be initiated using heat via the Hernon Manufacturing UV LED curing lights or anaerobically with the available low exotherm formulas. The Hernon Manufacturing full-service lab offers substrate thermal expansion matching and pulls from an active library of over 5000 different adhesive and sealant formulas to ensure strong adhesion to most substrates including composite materials.
Significant Features and Key Advantages of Hernon Manufacturing Potting Epoxies:
Bonds to a wide variety of substrates
High impact, shock, and vibration resistance
100% Solid System with NO solvents
Custom formulas are available to match thermal expansion rates of substrates
Thermal cycling tolerance (temperature stable)
Environmental resistance
Electrically insulating formulas are available
Resists corrosion
Clear, opaque, and color versions are available
Scan barcodes through clear epoxies
Secure components against tampering
Waterproof sensors and power sources
Low viscosity self-leveling fill material
Fast room temperature curing or low exotherm curing is available
Popular epoxies for potting:
Ultrabond® 721: A UV-curable adhesive that can be used to seal a variety of plastics when exposed to UV light. The sealant offers a watertight seal with excellent environmental resistance.
Silastomer® 343: A non-corrosive, non-slumping single component, room temperature RTV silicone adhesive/sealant. Formulated to maintain sealant integrity for over 25 years.
Tuffbond® 321: A flexible, low-viscosity, general-purpose resin system used for casting, potting, and encapsulating of electrical and electronic components.
Tuffbond® 317: A two-component room temperature cure system. By changing the ratio of resin and hardener the cured adhesive can change from a tough and flexible to a hard and rigid system.
Tuffbond® 316: A black version of Tuffbond® 317 is used to protect proprietary technologies from view.
Tuffbond® 302: A modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond 302 exhibits very good moisture, chemical, and heat resistance.
Silastomer® 343 is a black, high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Designed to provide excellent oil resistance and can be used as a form in place gasket. It will adhere to clean metals, glass, most types of wood, silicone resin, vulcanized silicone rubber, natural and synthetic fiber, ceramic, many plastics and painted surfaces. Silastomer® 343 provides excellent resistance to moisture, weathering, vibration, ozone and extreme temperatures. It can be applied in surface temperatures of 0°F to above 120°F with no loss in performance. Fully cured Silastomer® 343 can withstand extended periods at temperatures up to 400°F.
Hernon 397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond 397 will change from amber-yellow to a reddish brown upon cure.
Product Benefits
• High temperature resistance.
• Single component (no mixing, no pot life).
• Contains 150micron spacer beads for bond line control
• Solventless.
• Cures on demand (heat cure).
• Will not slip during cure.
• Changes color upon cure (yellow to brown).
• Excellent adhesion to various substrates.
• Gives high shear.
• Low water absorption.
Tuffbond® 302 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 302 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 302 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
Tuffbond® 316 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. Tuffbond® 316 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components.
Tuffbond® 317 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. The resin offers a unique combination of hardness and flexibility with high chemical and solvent resistance. Tuffbond® 317 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components.
Tuffbond® 321 is a flexible, low viscosity, general purpose resin system used for casting, potting, and encapsulating of electrical and electronic components. This unique product has been formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties.
Ultrabond® Sealant 721 is a UV curable adhesive that can be used to seal a variety of plastics when exposed to UV light. The sealant offers a water- tight seal with excellent environmental resistance. Prevents material escaping through a crimped seal. With Ultrabond® Sealant 721 a low powered UV lamp (Blacklight), can be used to inspect for the presence of adhesive on the substrates.
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